A heating element (24) for a vaporization device (10), a vaporization device (10) containing the heating element (24), and a method for vaporizing fluid ejected by an ejection head (22) are provided. The heating element (24) comprises a conductive layer (42), configured to be disposed on a substrate (40), wherein the heating element (24) is configured to have an effective surface area for fluid vaporization that is greater than a planar surface area defined by dimensions of the heating element (24).