An imaging module of the invention includes: an electrical cable a solid-state image sensing device and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.
