SEGI TAKESHI,MATSUDA YUSUKE,YAMAGAMI KATSUYA,NAKATATE KENICHI
申请号：
EP13753406
公开号：
EP2677736A4
申请日:
2013.03.29
申请国别(地区):
EP
年份:
2015
代理人:
摘要：
An imaging module of the invention includes: an electrical cable (1) a solid-state image sensing device (22) including an imaging unit (21) orthogonal to a direction of an axis of a front end of the electrical cable (1) and a flexible wiring substrate (30, 30A) including: a device-mounted portion (32) onto which the solid-state image sensing device (22) is mounted two extended portions (34e, 35e) which bend at both sides of the device-mounted portion (32) and extend from the device-mounted portion (32) so as to come close to each other with increasing distance from the device-mounted portion (32) two connection end portions (34f, 35f) extending from the two extended portions (34e, 35e) along the direction of the axis of the front end of the electrical cable (1) on an opposite side of the device-mounted portion (32) and terminals (34c, 34d, 35c, 35d) which are provided on the two connection end portions (34f, 35f) and connected to the electrical cable (1), the flexible wiring substrate electrically connecting the solid-state image sensing device (22) and the electrical cable (1).
