熱可塑性液晶ポリマーフィルムならびにこれを用いた積層体および回路基板

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专利权人:

株式会社クラレ

发明人:

小野寺 稔,砂本 辰也,松永 修始,今野 貴文

申请号：

JP20130541688

公开号：

JP6133782(B2)

申请日:

2012.10.09

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (µ r2 ) of the film after heating to a dielectric constant (µ r1 ) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30°C lower than a melting point of the film to a temperature being 10°C higher than the melting point,

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/