Method for automatically generating laser cutting lines in laser microdissection processes

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专利权人:

Frank Sieckmann

发明人:

Frank Sieckmann,Gerhard Johannsen

申请号：

US10576453

公开号：

US09217694B2

申请日:

2004.10.21

申请国别(地区):

US

年份:

2015

代理人:

摘要：

A laser microdissection method includes capturing an electronic image of an image detail of a specimen. The image detail is processed using, image analysis so as to automatically ascertain an object to be cut out. A nominal cutting line around the object to be cut out is automatically defined. Subsequently, the object is cut out in response to a relative motion between a laser beam and the specimen.

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