半導体装置
- 专利权人:
- 富士通セミコンダクター株式会社
- 发明人:
- 深澤 則雄
- 申请号：
- JP2005307737
- 公开号：
- JP4904769B2
- 申请日:
- 2005.10.21
- 申请国别(地区):
- JP
- 年份:
- 2012
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To provide a semiconductor device for a fingerprint sensor with its sensor face less curved in pressing without using any interposer and to provide a highly reliable semiconductor device for a fingerprint sensor less damaged by bending.
SOLUTION: A recess 8 (such as a groove 8a) is formed in an under surface of a semiconductor substrate 1 with a sensor surface 1a formed on its upper surface and an external terminal 4 formed on the under surface to provide a second sealing resin 7 for filling up the recess 8 therewith to seal the under surface. Since the hard sealing resin 7 is thickened by the depth of the recess 8, the flexural rigidity of a semiconductor device 100 for a sensor is increased. In another configuration, a reinforcing plate of an elastic body is provided on an under surface of the sealing resin 7 to increase the flexural rigidity. In a furthermore other configuration, a frame-like groove is provided along the periphery of the semiconductor substrate.
COPYRIGHT: (C)2007,JPO&INPIT
- 来源网站：
- 中国工程科技知识中心
