PROBLEM TO BE SOLVED: To provide a Cu-Zn-Sn-Ni-P-based alloy which includes at least 3 mass% of Zn whose raw material cost is inexpensive compared to Cu and Ni, allows containing of Sn incorporated in copper scraps, has low cost, and is simultaneously excellent in strength, bendability, and stress relaxation resistance characteristics.SOLUTION: A Cu-Zn-Sn-Ni-P-based alloy includes, by mass, 0.2-0.8% of Sn, 3-18% of Zn, 0.3-1.2% of Ni, and 0.01-0.12% of P, with the balance comprising Cu and unavoidable impurities, has a grain size of 1-10 μm, and satisfies I(220)/I(220)≤3.0 and I(311)/I(311)≤0.5 when it is assumed that X-ray diffraction intensity from the surface (220) is I(220), the X-ray diffraction intensity from the surface (311) is I(311), and the X-ray diffraction intensities of a standard sample of pure copper powders from the surfaces (220) and (311) are I(220) and I(311) respectively.
