Tirunelveli S. Sriram;Brian R. Smith;Bryan L. McLaughlin
发明人:
Brian R. Smith,Tirunelveli S. Sriram,Bryan L. McLaughlin
申请号：
US13490189
公开号：
US09224664B2
申请日:
2012.06.06
申请国别(地区):
US
年份:
2015
代理人:
摘要：
An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.
