PROBLEM TO BE SOLVED: To provide a photocurable resin composition which has type D durometer hardness of D30 or more and is excellent in finger slipperiness of a cured surface while having good photocurability, and has a highest heat generating temperature at the time of curing of lower than 55°C, when being cured with an ultraviolet irradiation machine such as an LED light source.SOLUTION: A photocurable resin composition contains an urethane (meth)acrylate resin (A) having a polytetramethylene glycol skeleton and the number of functional groups of 2-5, a (meth)acrylate monomer (B), a polyether-modified polysiloxane copolymer (C) and a photopolymerization initiator (D), in which a weight ratio of a polysiloxane bond in (C) is 14 wt.% or less.SELECTED DRAWING: NoneCOPYRIGHT: (C)2020,JPO&INPIT【課題】ＬＥＤ光源等の紫外線照射機で硬化させた場合、良好な光硬化性を有しつつ、タイプＤデュロメーター硬度がＤ３０以上でかつ硬化表面の指滑り性に優れ、硬化時の最高発熱温度が５５℃未満である光硬化性樹脂組成物を提供する。【解決手段】ポリテトラメチレングリコール骨格を有し官能基数が２～５のウレタン（メタ）アクリレート樹脂（Ａ）と、（メタ）アクリレートモノマー（Ｂ）と、ポリエーテル変性ポリシロキサンコポリマー（Ｃ）と、光重合開始剤（Ｄ）とを含み、前記（Ｃ）におけるポリシロキサン結合の重量比率が１４重量％以下であることを特徴とする光硬化性樹脂組成物である。【選択図】なし
