Rajesh V. Iyer,Michael G. Marinkov,Lea A. Nygren,Brad C. Tischendorf
申请号：
US13772490
公开号：
US20130289681A1
申请日:
2013.02.21
申请国别(地区):
US
年份:
2013
代理人:
摘要：
Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.
