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FIL GUIDE INTRAVASCULAIRE MULTI-SEGEMENT AVEC UN SOUDAGE ; PROCÉDÉ DE NEUTRALISATION DES EFFETS DE REBOND PENDANT LE SOUDAGE PAR RÉSISTANCE À L'ÉTAT SOLIDE DE MATÉRIAUX DISSEMBLABLES
专利权人:
Abbott Cardiovascular Systems; Inc.
发明人:
申请号:
EP17159014.4
公开号:
EP3192608B1
申请日:
2014.01.16
申请国别(地区):
EP
年份:
2019
代理人:
摘要:
The present disclosure is directed to a method of joining initially separate members of different metallic materials, e.g., as in joining segments (302', 304') of a multi-segment intravascular guide wire, as well as multi-segment intravascular guide wires so formed. Initially separate members (302', 304') are provided, which members (302', 304') comprise different metallic materials relative to one another (e.g., stainless steel and nitinol). The members (302', 304') are aligned with one another, and a first force is applied to the members (302', 304') while delivering electrical current through the members (302', 304') to solid state weld the separate members (302', 304') to one another. A follow up force that is greater than the first force is applied as solid-state deformation occurs and a weld nugget (322') forms between the members (302', 304'). The weld nugget (322') so formed is thinner and of a larger transverse cross-sectional area than would be produced without application of the follow up force.
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