A method to control tissue/device heating at implantable medical devices including neuroprosthetic devices. In a first embodiment, thermal conductivity of components of the implantable medical devices including the neuroprosthetic devices is increased. In a second embodiment, the implantable medical devices including the neuroprosthetic devices are cooled by using heat-sinks. In a third embodiment, portions of the implantable medical devices including the neuroprosthetic devices are replaced with specific thermal properties. In a fourth embodiment, the implantable medical devices including the neuroprosthetic devices are coated with a drug/material that will induce surrounding tissue to become more resistant to temperature increases. In a fifth embodiment, the temperature increase near the implantable devices including the neuroprosthetic devices is determined using a modified bio-heat transfer model. In a sixth embodiment, the shape of the outer or the inner surface of the device is modified.
