PROBLEM TO BE SOLVED: To provide a mounting structure which allows for downsizing, an imaging module, and an endoscope apparatus comprising an imaging module.SOLUTION: The mounting structure 40 according to the present invention comprises: a multilayer substrate 46； an electronic component 55 mounted in a first region S1 of the front face of the multilayer substrate 46, using a bump 57a； an insulating adhesive 57 for bonding the back face of the electronic component 55 and the front face of the multilayer substrate 46； and an electronic component 56 mounted in a second region S2 of the front face of the multilayer substrate 46. A groove 58 is formed around the electronic component 55 mounted in the first region S1. The thickness L1 of the multilayer substrate 46 in the first region S1 and the thickness L2 of the multilayer substrate 46 in the second region S2 are set such that a height T1 from the bottom face of the multilayer substrate 46 in a section where the first region S1 appears as the front face of the substrate to the electronic component 55 is equal to or less than a height T2 from the bottom face of the multilayer substrate 46 in a section where the second region S2 appears as the front face of the substrate to the electronic component 56.SELECTED DRAWING: Figure 4
