PROBLEM TO BE SOLVED: To provide a device mounting structure which can be easily created without a difficult process such as routing of wiring to the front and back and via processing of a base material. SOLUTION: A device mounting structure includes a base material having a thickness of 0.2 mm or less, an electronic component provided on one side of the base material, an electrode provided on one side of the base material and acquiring biological information, and a base. The surface of the electrode is provided with a wiring provided on one side of the material for electrically conducting the electronic component and the electrode, and a reinforcing resin that covers and reinforces the base material, the wiring, the electronic component, and a part of the electrode. The height of the surface of the electrode is higher than the surface of the base material, wiring, electronic components, and the reinforcing resin that reinforces the electrode, while being not covered with the reinforcing resin and being exposed from the reinforcing resin. [Selection diagram] Fig. 1【課題】配線の表裏への引き回しや、基材のビア加工等の困難なプロセスが無く、容易に作成可能なデバイスの実装構造体を提供する。【解決手段】デバイスの実装構造体は、厚み０．２ｍｍ以下の基材と、基材の片面に設けられた電子部品と、基材の片面に設けられ、生体情報を取得する電極と、基材の片面に設けられ、電子部品と電極とを電気的に導通する配線と、基材、配線、電子部品、及び電極の一部を覆って補強する補強樹脂と、を備え、電極の表面は、補強樹脂で覆われず、補強樹脂から露出していると共に、電極の表面の高さは、基材、配線、電子部品及び電極を補強する補強樹脂の表面よりも高い。【選択図】図１
