Rajmohan Bhandari,Sandeep Negi,Florian Solzbacher,Richard A. Normann
申请号：
US11807766
公开号：
US08865288B2
申请日:
2007.05.29
申请国别(地区):
US
年份:
2014
代理人:
摘要：
A micro-needle array having tips disposed along a non-planar surface is formed by shaping the wafer surface into a non-planar surface to define the tips of the micro-needles. A plurality of trenches are cut into the wafer to form a plurality of columns having tops corresponding to the non-planar surface. The columns are rounded and sharpened by etching to form the micro-needles.
