David Thordarson;Frank A. Liporace;Paul Thomas Slagle;Dan Dziadosz;George J. Haidukewych;Jordi Asuncion Marquez;William Scott Van Dyke;Jordan Grossman
发明人:
William Scott Van Dyke,Frank A. Liporace,Dan Dziadosz,Jordan Grossman,Jordi Asuncion Marquez,Paul Thomas Slagle,George J. Haidukewych,David Thordarson
申请号：
US15901221
公开号：
US20180235678A1
申请日:
2018.02.21
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Various modular implants and modular implant systems are disclosed herein, as are methods of implanting the same. The modular implant systems can include modular implants that are stacked on each other to define a modular implant system, which in an example can be used to replace or augment a void in bone. The modular implants can interact with an intramedullary implant to, for instance, assist with a fusion procedure.
