Michael F. Mattes,Mark A. Zielke,Jonathan McCann,Richard D. Lintern,Samuel Pollock
申请号：
US14976070
公开号：
US20170172731A1
申请日:
2015.12.21
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A bio-compatible packaging for an optoelectronic device is presented, to essentially eliminate moisture ingress and corrosion of the internal electronics of the device after it is implanted for in-vivo use. In some implementations, the optoelectronic device includes an optoelectronic assembly that includes an electronic module, an optoelectronic module, a power source, configured to energize the electronic module and the optoelectronic module, and an electronic interconnect to provide electronic couplings between the electronic module, the optoelectronic module, and the power source. The device further includes a bio-compatible packaging, having a transparent front window and a transparent back window, the bio-compatible packaging configured to enable light to enter the optoelectronic device through the front window, propagate through the optoelectronic module, and leave the optoelectronic device through the back window, and to hermetically seal the optoelectronic assembly.
