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Imaging detector module assembly
专利权人:
コーニンクレッカ フィリップス エヌ ヴェ
发明人:
シャッポ,マーク アンソニー,シャッポ,マーク アンソニー
申请号:
JP2016572275
公开号:
JP6285577B2
申请日:
2016.01.07
申请国别(地区):
JP
年份:
2018
代理人:
摘要:
A module assembly device (402) is configured for assembling a module assembly (114) for a detector array (110) of an imaging system (100). The module assembly device includes a base (400) having a long axis (401). The module assembly device further includes a first surface (406) of the base and side walls (408) protruding perpendicular up from the first surface and extending in a direction of the long axis along at least two sides of the base. The first surface and side walls form a recess (404) configured to receive the module substrate on the surface and within the side walls. The module assembly device further includes protrusions (403) protruding from the side walls in a direction of the side walls. The protrusions and side walls interface forming a ledge which serves as a photo-detector array tile support (410) configured to receive the photo-detector array tile (118) over the ASIC and the module substrate.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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