ＣＭＰ用シリカ、水性分散液およびＣＭＰ用シリカの製造方法

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专利权人:

株式会社トクヤマ

发明人:

中村 正博,石本 竜二

申请号：

JP20150528223

公开号：

JP6082464(B2)

申请日:

2014.07.10

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

To reduce scratches during polishing while ensuring an appropriately high polishing rate, provided are a silica for CMP satisfying the following (A) to (C), an aqueous dispersion using a silica for CMP, and a method of producing a silica for CMP: (A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/