A sensing assembly including a sensing device and a binding component is provided. The sensing device includes a battery module, a circuit board module, and a physical condition sensor. The circuit board module covers a top surface, a bottom surface opposite to the top surface, and a side surface connecting the top surface and the bottom surface of the battery module. The physical condition sensor is disposed on an outer surface of the circuit board module and is configured to contact a sensing region of a user to detect a physical condition signal of the sensing region. The binding component is coupled to the sensing device to fix the sensing device to the sensing region of the user.
