The invention discloses an endoscope apparatus with a wafer level lens comprising a hollow pipe, a housing, a wafer level lens module, a plurality of solder dots, a luminous element, and a PCB board. The housing is disposed in the front end of the hollow pipe. The housing comprises an accommodating portion. The wafer level lens module is disposed in an accommodating portion and comprises a lens and an image sensor integrally. The solder dots are disposed on the image sensor and opposite to the lens. By disposing the wafer level lens module in the accommodating portion, the sizes of conventional lens and image sensor can be reduced, so as to reduce greatly the internal diameter of the housing and the hollow pipe.本發明係揭露一種晶圓級鏡頭之內視鏡裝置,其係包含一中空管、一殼體、一晶圓級鏡頭(wafer level lens)模組、複數個焊料凸點、一發光元件及一印刷電路板。殼體位於中空管前段,殼體具有一容置空間。晶圓級鏡頭模組係位於容置空間中,晶圓級鏡頭模組具有一體成型之一鏡頭及一影像感測器。焊料凸點係位於影像感測器之一面上而背對鏡頭,藉由上述晶圓級鏡頭模組設置於殼體容置空間中,可降低習知鏡頭及影像感測元件之體積尺寸,而大幅縮小容置晶圓級鏡頭模組之殼體內徑,連帶縮小中空管管徑。12‧‧‧殼體121‧‧‧容置空間122‧‧‧弧面狀13‧‧‧晶圓級鏡頭模組131‧‧‧鏡頭1311‧‧‧透鏡132‧‧‧鏡頭殼體133‧‧‧影像感測器14‧‧‧焊料凸點15‧‧‧印刷電路板16‧‧‧發光元件2‧‧‧光線
