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ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL BACK FACE ATTACHMENT
专利权人:
General Electric Company
发明人:
Flavien Daloz,Jason Barrett,Edouard Da Cruz,Jean Pierre Malacrida
申请号:
US15385671
公开号:
US20180175278A1
申请日:
2016.12.20
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
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