David S. Pellinen,Jamille Farraye Hetke,Daryl R. Kipke,Kc Kong,Rio J. Vetter,Mayurachat Ning Gulari
申请号：
US14030069
公开号：
US20140027888A1
申请日:
2013.09.18
申请国别(地区):
US
年份:
2014
代理人:
摘要：
The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion； building a preliminary structure coupled to the base； removing a portion of the preliminary structure to define a series of devices and a plurality of bridges； removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame； and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.
