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ULTRASONIC DEVICE, ULTRASONIC MODULE, ELECTRONIC APPARATUS, AND ULTRASONIC MEASUREMENT APPARATUS
专利权人:
Seiko Epson Corporation
发明人:
Kanechika KIYOSE,Hikaru IWAI
申请号:
US15219623
公开号:
US20170031024A1
申请日:
2016.07.26
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An ultrasonic device includes an element substrate provided with an ultrasonic transducer array having a plurality of ultrasonic transducers arranged in an array, and having a first surface and a second surface located on an opposite side to the first surface, a terminal part disposed on the first surface of the element substrate, and outside the ultrasonic transducer array in a planar view viewed from a normal direction of the first surface, and electrically connected to the ultrasonic transducers, and a reinforcing plate disposed on the second surface of the element substrate in an area overlapping the terminal part in the planar view, and higher in bending rigidity than the element substrate.
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