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Compact multilevel electrical integration of microsystems
专利权人:
Mayurachat Ning Gulari;Gayatri Eadara Perlin;Brendan E. Casey;Kensall D. Wise
发明人:
Gayatri Eadara Perlin,Brendan E. Casey,Mayurachat Ning Gulari,Kensall D. Wise
申请号:
US12415177
公开号:
US08255061B2
申请日:
2009.03.31
申请国别(地区):
US
年份:
2012
代理人:
摘要:
A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section—the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.
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