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MULTI-LAYERED STENTS AND METHODS OF IMPLANTING
专利权人:
Medtronic; Inc.
发明人:
Philipp Bonhoeffer,Silvia Schievano,Timothy R. Ryan,Timothy G. Laske
申请号:
US14537673
公开号:
US20150066134A1
申请日:
2014.11.10
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A method of percutaneously delivering a multi-layered stent assembly to a desired implantation location of a patient including the steps of radially compressing a multi-layered stent assembly to a compressed size for implantation in a patient, the multi-layered stent assembly including a first stent, a second stent coaxially positioned within at least a portion of a length of the first stent, and a valve, wherein the first stent comprises at least one different material property than the second stent. The method further includes delivering the multi-layered stent assembly to the desired implantation location of the patient using a delivery system and substantially simultaneously expanding the first stent and the second stent of the multi-layered stent assembly at the desired implantation location to a radially expanded size that is larger than the compressed size.
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