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Multi-layered stents and methods of implanting
专利权人:
Inc.;Medtronic
发明人:
Schievano, Silvia,Ryan, Timothy R.,Bonhoeffer, Philipp,Laske, Timothy G.
申请号:
AU2008216670
公开号:
AU2008216670B2
申请日:
2008.02.15
申请国别(地区):
AU
年份:
2013
代理人:
摘要:
A method of percutaneously delivering a multi-layered stent assembly to a desiredimplantation location of a patient including the steps of radially compressinga multi-layered stent assembly to a compressed size for implantation in a patient,the multi-layered stent assembly including a first stent (52), a second stent(54) coaxially positioned within at least a portion of a length of the first stent,and a valve, wherein the first stent comprises at least one different materialproperty than the second stent. The method further includes delivering the multi-layeredstent assembly to the desired implantation location of the patient using a deliverysystem and substantially simultaneously expanding the first stent and the secondstent of the multi-layered stent assembly at the desired implantation locationto a radially expanded size that is larger than the compressed size.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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