PROBLEM TO BE SOLVED: To provide an endoscope apparatus capable of suppressing deterioration due to heating of soldering connecting a substrate and a part.SOLUTION: The endoscope apparatus regarding a configuration of one implement includes: an insertion section which is capable of being sterilized by boiling an operation section which is connected to this insertion section and a device body which is connected to the operation section. The endoscope apparatus includes: a first circuit substrate integrated in the device body section a first electronic part which is electrically connected to the first circuit substrate through a first soldering a second circuit substrate integrated in at least one of the insertion section or the operation section a second electronic part which is electrically connected to the second circuit substrate through a second soldering with higher stress resistant property than the first soldering and an adhesive member adhered to the second electronic part and the second circuit substrate and having a higher glass transition point than the second circuit substrate.
