Mold stain removing composition

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专利权人:

花王株式会社

发明人:

鈴木 不律,小松 洋介

申请号：

JP2010046241

公开号：

JP5419754B2

申请日:

2010.03.03

申请国别(地区):

JP

年份:

2014

代理人:

摘要：

<；P>；PROBLEM TO BE SOLVED: To provide a composition for removing mold stains effective in removing mold stains formed on a soft part such as resin as well as on a hard surface. <；P>；SOLUTION: There is provided a composition for removing mold stains comprising (a) an alkali metal hypochlorite, (b) a specified quaternary ammonium-type surfactant, and (c) a specified polyether-modified silicone of an HLB of &ge；11 in mass%, in specified ranges. <；P>；COPYRIGHT: (C)2011,JPO&INPIT

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