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Method for producing a microstructure component, microstructure component and x-ray device
专利权人:
Siemens Healthcare GmbH
发明人:
Andrea Deutinger,Joerg Zapf
申请号:
US16281299
公开号:
US10714228B2
申请日:
2019.02.21
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.
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