The purpose of the present invention is to provide an image pickup unit, an endoscope, and a manufacturing method for an image pickup unit, by which the diameter of the image pickup unit can be made smaller and insulation between an inner lead and a solid state image pickup element can be achieved. This image pickup element 35 is provided with the following: a solid state image pickup element 44； a flexible print substrate 45 that includes an insulative base material 45a and a wiring layer 45b formed on the base material 45a, and that extends to a rear surface side which is a surface opposing a light receiving surface of the solid state image pickup element 44； and a laminated substrate 46 that is connected to the wiring layer 45b side of the flexible print substrate 45, and that has mounted thereon electronic components 55, 56. The image pickup element is characterized by the following: the wiring layer 45b is exposed from the base material 45a； an inner lead 45c is connected to an electrode pad 44b of the solid state image pickup element 44, and includes a first peak-shaped bend 45f-1 that protrudes toward the laminated substrate 46 side； and the position of the first peak-shaped bend 45f-1 is farther back than a rear surface f1 of the light receiving surface of the solid state image pickup element 44.La présente invention a pour objet de réaliser une unité de capture d'images, un endoscope, et un procédé de fabrication d'une unité de capture d'images, par lequel le diamètre de l'unité de capture d'images peut être réduit et l'isolation entre un conducteur interne et un élément de capture d'images à semiconducteur peut être obtenue. L'élément de capture d'images (35) selon l'invention est pourvu des éléments suivants : un élément de capture d'images à semiconducteur (44) ； un substrat d'impression flexible (45) qui comprend un matériau de base isolant (45a) et une couche de câblage (45b) formée sur le matériau de base (45a), et qui s'étend jusqu'à un côté de surfa
