An image pickup apparatus includes a camera assembly including an image sensor chip including a light receiving section configured to receive light of an object image, a driving circuit chip stacked on the image sensor chip, and a thin film capacitor chip stacked on the driving circuit chip, the image sensor chip, the driving circuit chip, and the thin film capacitor chip being stacked and bonded to one another, and a plurality of wiring connection sections formed in a hole shape by a through-silicon via connected by a core of a wiring of a cable being inserted into a back surface, on a side opposite to a bonding surface of the thin film capacitor chip to the driving circuit chip.
