In an embodiment, a material includes at least one outer section and a midsection attached to the outer section. The midsection includes a first antimicrobial membrane patch layer configured to contact a body, a second antimicrobial membrane patch layer disposed adjacent to the first antimicrobial patch layer, and an air gap disposed between the first patch and second antimicrobial patch layers. The first and second antimicrobial patch layers each are formed from respective balanced warp tows and fill tows in a plain-weave pattern, and each layer include copper filaments disposed in a plurality of the tows, each of the copper filaments including at least Cu+ or Cu+++ ions. Such a material may be suitable for notification and protection of a body from a soil deposited on the material.
