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ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION
专利权人:
The Board of Trustees of the University of Illinois;Northwestern University
发明人:
John A. ROGERS,Hui FANG,Jianing ZHAO,Enming SONG,Yoon Kyeung LEE
申请号:
US16162613
公开号:
US20200022601A1
申请日:
2018.10.17
申请国别(地区):
US
年份:
2020
代理人:
摘要:
Provided are methods of making a long-term implantable electronic device, and related implantable devices, including by providing a substrate having a first encapsulation layer that covers at least a portion of the substrate, the first encapsulation layer having a receiving surface; providing one or more electronic devices on the first encapsulation layer receiving surface; and removing at least a portion of the substrate from the first encapsulation layer; thereby making the long-term implantable electronic device. Further desirable properties, including device lifetime increases during use in environments that are challenging for sensitive electronic device components, are achieved through the use of additional layers such as longevity-extending layers and/or ion-barrier layers in combination with an encapsulation layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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