Resin composition, backing material for ultrasonic oscillator, ultrasonic oscillator and ultrasonic endoscope

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专利权人:

オリンパス株式会社

发明人:

小林 恒司,林 孝枝,小尾 邦寿

申请号：

JP2014083180

公开号：

JP6246050B2

申请日:

2014.04.14

申请国别(地区):

JP

年份:

2017

代理人:

摘要：

A resin composition of the present invention contains: an epoxy resin (A)； a hardener (B)； and an ion exchanger (C). At least one of the epoxy resin (A) and the hardener (B) contains a modified silicone (S), and the epoxy resin (A) is at least one type selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, and an epoxy-modified silicone.

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