CHAN KWOK PONG,HAGBERG ERIK,MULLEN TARA J,ODLE ROY RAY
申请号：
IN10179/DELNP/2008
公开号：
IN259285B
申请日:
2008.12.08
申请国别(地区):
IN
年份:
2014
代理人:
摘要：
A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4"-oxydiphthalic dianhydride, 3,3"-oxydiphthalic dianhydride, 4,4"-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4"-diaminodiphenylsulfone wherein the polyimide has a glass transition temperature from 190°C to 400°C and wherein the film has a coefficient of thermal expansion of less than 60 ppm/°C, a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.
