A feedthrough for an implantable medical electronic device that has a housing and a header. The feedthrough having an insulator that has a housing-side surface and a header-side surface opposite it, a feedthrough flange surrounding the insulator, and at least one primary connection element penetrating the insulator and for connection of an electrical or electronic component of the device. This electrical or electronic component is arranged in the housing. The connection element is fastened by a hard solder connection, so that it is fluid-tight in a passage of the insulator. The primary connection element has a housing-side end that is essentially even with the housing-side surface of the insulator or is recessed into the insulator with respect to this surface.
