The implantation pin kit comprises: a cannulated implantation pin (1) having a channel (11) and a heating device (19). The channel (11) of the pin (1) extends in a longitudinal direction of the pin (1) and connects a proximal opening (13) at a proximal end of the pin (1) with a distal opening (15) at a distal end of the pin (1).The channel (11) of the pin (1) and the heating device (19) are adapted such that the heating device (19) can be accommodated within at least a portion of the channel (11) of the pin (1). The heating device (19) is adapted to thermally heat material comprised in at least one of the pin (1) and the heating device (19). Thereby, meltable material of the pin (1) can be liquefied or additional liquefied meltable material can be inserted into the pin and the liquefied material can then be push towards and out of the distal opening (15) in order to augment and fix the implantation pin (1) in a target structure (5).
