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HEAT EXCHANGE MODULE, SYSTEM AND METHOD
专利权人:
HYPOTHERMIA DEVICES, INC.;THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
发明人:
Julio L. Vergara,Daniel M. Estrada,Mayank Kalra,Andrew Padula,Daniel E. Cuadra,Ryan C. Cohn
申请号:
US16365567
公开号:
US20190262169A1
申请日:
2019.03.26
申请国别(地区):
US
年份:
2019
代理人:
摘要:
A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.
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中国工程科技知识中心
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