您的位置: 首页 > 农业专利 > 详情页

Low impedance, low modulus wire configurations for a medical device
专利权人:
Inc.;Medtronic
发明人:
Bernard Q. Li,Ling Wang
申请号:
US14157559
公开号:
US08843214B2
申请日:
2014.01.17
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Techniques are disclosed related to wires that may be used within a medical device. According to one example, a wire may include a core formed of a material having a resistivity of less than 25 micro-ohm-cm and a layer of a biocompatible beta titanium alloy surrounding the core. As one example, the beta titanium alloy has an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa and comprises at least two elements from a group consisting of titanium, molybdenum, niobium, tantalum, zirconium, chromium, iron and tin. In one embodiment, the core may be formed of silver, tantalum, a tantalum alloy, niobium, a niobium alloy, platinum, a platinum alloy, palladium, or a palladium alloy. In some examples, one or more wires may be incorporated into a coil or a cable and one or more such coils or cables may be carried by a medical device such as a medical electrical lead.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充