A pressure-sensitive adhesive tape package is disclosed in which easiness in applying the adhesive tape is pursued, and an effect of savings in resources can be obtained. The pressure-sensitive adhesive tape package according to the present invention accommodates an adhesive tape 14 having a support 20 and an adhesive agent layer 12 provided on one surface of the support, the adhesive tape 14 being bent into a first portion 22 and a second portion 24 such that the adhesive agent layer faces outward. Moreover, the pressure-sensitive adhesive tape package includes a first release sheet 16 releasably attached to the adhesive agent layer of the first portion of the adhesive tape, and a second release sheet 18 releasably attached to the adhesive agent layer of the second portion of the adhesive tape to seal the adhesive tape with the first release sheet between the first and second release sheets. In this configuration, the conventionally existing package can be eliminated. Moreover, when the second release sheet is removed from the adhesive agent layer of the second portion of the adhesive tape, a half of the adhesive agent layer is exposed； accordingly, application to a portion for application is easy.
