A pressure-sensitive adhesive tape package is described in which while easiness in applying the adhesive tape is pursued, an effect of saving in resources can be obtained. The pressure-sensitive adhesive tape package accommodates an adhesive tape having a support and an adhesive agent layer provided on one surface of the support, and includes a release sheet releasably attached to the adhesive agent layer. Moreover, in the pressure-sensitive adhesive tape package, the release sheet is bent along a predetermined bending line with the adhesive tape, and the adhesive tape is sealed inside of the bent release sheet.
