According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling an operation unit connected to the insertion part a main unit connected to the operation unit a first circuit board embedded in the main unit a first electronic component electrically connected to the first circuit board via a first solder a second circuit board embedded in at least any one of the insertion unit and the operation unit a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.
