There is provided an endoscope imaging unit including parallel electric wires, an image sensor located on a front end side by being separated from front ends of the respective electric wires, and having a light incident surface substantially perpendicular to the electric wires, a flexible substrate located between the electric wires and the image sensor, having a circuit, and conductively connecting the respective electric wires to the circuit, an image sensor mounting peninsula portion bent with respect to the substrate, and mounting the image sensor thereon by conductively connecting the image sensor to the circuit, and a circuit mounting peninsula portion extending from the substrate, located by being bent to a side opposite to the image sensor before the image sensor mounting peninsula portion, and mounting and conductively connecting an electronic component or the circuit pattern to the circuit.
