Provided is a bonding method and device which can prevent destruction of a layer with low toughness when bonding a film including the layer with low toughness to a bonding target object. A bonding target object and a film including a layer having lower toughness than the bonding target object are disposed between a set of pressurization molds, which have pressurization surfaces disposed so as to face each other and in which opening holes are formed in the pressurization surfaces. A first edge on the opening hole side of the pressurization surface of a first pressurization mold, out of the set of pressurization molds, which faces the film is positioned further inside the opening hole than a second edge on the opening hole side of the pressurization surface of a second pressurization mold which faces the bonding target object. The pressing target portion of the film which is pressed by the set of pressurization molds is bonded to the bonding target object by sandwiching the bonding target object and the film with the set of pressurization molds to be pressed.
