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Method to pattern <10 micrometer conducting and passivating features on 3D substrates for implantable devices
专利权人:
发明人:
Vanessa Tolosa,Satinderpall S. Pannu,Heeral Sheth,Angela C. Tooker,Kedar G. Shah,Sarah H. Felix
申请号:
US14213733
公开号:
US09694190B2
申请日:
2014.03.14
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.
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