Ronald Dekker,Vincent Adrianus Henneken,Angel Metodiev Savov
申请号：
US15035779
公开号：
US20160256133A1
申请日:
2014.10.16
申请国别(地区):
US
年份:
2016
代理人:
摘要：
An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.
