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Transcatheter valve delivery system with septum hole closure tip assembly
专利权人:
Medtronic Vascular; Inc.
发明人:
Marc Anderson
申请号:
US15609203
公开号:
US10449044B2
申请日:
2017.05.31
申请国别(地区):
US
年份:
2019
代理人:
摘要:
Transcatheter heart valve delivery systems having a tip assembly configured to close the hole or perforation made in a patient's septal wall after transseptal delivery of a stented prosthetic heart valve to a defective heart valve (e.g., a mitral valve). The delivery device is configured to permit in vivo release of the tip assembly immediately after deployment of the stented prosthetic heart valve to implant the tip assembly into the septal wall proximate the hole through which the stented prosthetic heart valve is delivered. Methods of treating the defective heart valve, including closing the hole made during transseptal delivery of the stented prosthetic heart valve with the tip assembly of the delivery device are also disclosed.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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