Method for bonding a tantalum structure to a cobalt-alloy substrate

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专利权人:

发明人:

申请号：

EP08253300.1

公开号：

EP2047937B1

申请日:

2008.10.09

申请国别(地区):

EP

年份:

2015

代理人:

摘要：

A method for bonding a porous tantalum structure (10) to a substrate (12) is provided. The method comprises providing a substrate (12) comprising cobalt or a cobalt-chromium alloy an interlayer (16) consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof and a porous tantalum structure (10). Heat and pressure are applied to the substrate (12), the interlayer (16), and the porous tantalum structure (10) to achieve solid-state diffusion between the substrate (12) and the interlayer (16) and between the interlayer (16) and the porous tantalum structure (10).

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