The patch bonding device of this creation,System include: one the cloth material accepted is transmitted towards direction initialization cloth material feeding mould group,One the separated type material accepted is transmitted towards direction initialization separated type material charging mould group,One by dressing coating what cloth material dressing charging mould group,One mutually overlays cloth material and separated type material the bonding mould group of bonding,And one control mould group； Wherein,Mould group is binded,It is additionally provided with a heating component to heat to cloth material,It can reinforce the bonding effect of dressing Yu cloth material,In order to the difficulty of processing that can be effectively reduced patch,And with relatively low material cost be made stabilized structure,Reliable patch.本創作之貼布黏合裝置，係包括：一將所承接之布質材料朝設定方向傳送的布質材料進料模組、一將所承接之離型材料朝設定方向傳送的離型材料進料模組、一將敷料披覆於布質材料上的敷料進料模組、一將布質材料及離型材料相互壓貼黏合的黏合模組，以及一控制模組；其中，黏合模組，另設有一用以對布質材料加熱的加熱組件，可加強敷料與布質材料之黏合效果，俾能夠有效降低貼布之加工難度，並且以相對較低的材料成本製成結構穩固、可靠的貼布。
